Original Article Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights Author(s): E. Suhir*
Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights
March 16-17, 2020
July 01-02, 2020
November 20-21, 2020
