E. Suhir | USA

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Portland State University, Portland, USA

Publications

Original Article

Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights

Author(s): E. Suhir*
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Recommended Conferences

July 01-02, 2020

World Congress on Physics

Paris, France

November 20-21, 2020

International Conference on Materials Physics and Materials Science

Tokyo, Japan

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